Services
FPGA & SoC Services
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ASIC Design Services
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Module & Hybrid Design Services
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Package Miniaturization Design ServicesLarge Area Panel (LAP) - based Embedded Die technology to perform sub-system size reduction levels that cannot be achieved via standard chip-on-board technology. |
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Rugged Power Supply Design
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Synchronization ServicesSpecialized services to help with planning, deployment and maintenance of your synchronization infrastructure. |